Title:

Design and optimization of a micron-sized bonding technique for electronic measurements of 2-D material flakes

As the pace of technology continues to accelerate scientists have a greater need for exploring materials at a smaller level. Scanning tunneling microscopes (STM) are currently used to get an atomic view of two dimensional materials, but sample preparation can be resource and time intensive. Along with investigations using STM’s it is useful to be able to have precise manipulation on a micro-scale of materials. I have improved upon an existing, unfinished method for two dimensional (2-D) material manipulation on a micro-scale. This method utilizes a 3-axis flake transfer station, a 3-axis stage, and gold wires that are dipped in indium. I used these instruments to manipulate the wires and so that they could be attached to flakes smaller than 100 µm. I created a technique for dipping the gold wires in Indium to create extremely fine tips that improve accuracy of the flake attachment. It has been proven that this method allows for successful creation of conductive pads to be precisely attached to graphite and graphene flakes, along with running resistance and current tests on these materials. I have also used this method to create samples for STM analysis, this method allows the samples to be prepared faster than conventional means.

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